System level design and HW/SW co-design
Embedded System design practices
Operating systems and scheduling
Software and compiler issues for heterogeneous multi-core Embedded platform
Embedded System architecture
Power/thermal-aware design issues
Memory issues for multi-core Embedded platform
Hardware and Software techniques for fault tolerance
Reconfigurable computing architecture and Software support
Real-time operating systems
Programming languages and run-time systems
Design and analysis tools
Communication networks and protocols
Media processing and transmissions
Real-time aspects of wireless sensor networks
Energy aware real-time methods
Case studies and applications
UBIQUITOUS COMPUTING/CYBER-PHYSICAL SYSTEMS
Real-time issues in ubiquitous computing and cyber-physical systems
Tools, infrastructures and architectures for ubiquitous computing and cyber-physical systems
Devices and enabling technologies for ubiquitous computing and cyber-physical systems
Design and verification methodologies for cyber-physical systems
Applications of wireless sensor networks
Ubiquitous computing applications
Cyber-physical systems applications
User interfaces and interaction design issues for ubiquitous computing
Privacy and security issues and implications of ubiquitous computing
Location-dependent and context-aware computing
Evaluation methods for ubiquitous computing devices, systems, and applications
| IMPORTANT DATES
Review Paper Submission: October 20, 2014 (Extended)
Acceptance Result Notification: November 5, 2014
Camera Ready and Registration: November 15, 2014
| ELECTRONIC SUBMISSION
All papers should be submitted by online system for review (at least 4 pages, max 8 pages). Every submitted paper will be carefully reviewed by at least three members of the International Program Committee.
Just focus on and express your research contributions to reduce the time for review process.
Do not exceed to 8 pages in LNCS paper format.
Please download paper format from: Click here!
Please visit and submit your paper: http://edas.info/N18537
If you cannot upload you paper by submission system, please send your paper to email@example.com directly.
Only 50 high quality papers will be accepted, and will be published by SCOPUS or EI indexed journals.
1. Conference Proceedings:
All papers accepted and registered will be included in conference proceedings, ASTL series, and will be sent to EI.
2. Journal Publish:
All accepted 50 papers will be included in one of international journals after revision and extension.
In the acceptance letter, target journal will be noticed together.
| SPECIAL SESSION
Call for Special Session
Several special sessions will be held in conjunction with our workshop with the aim to explore special topics and provide international forums for scientists, engineers, and experts to exchange and share their experiences, new ideas, and research results on hot topics.
Papers accepted and registered will be included in ASTL conference proceedings published by SERSC and selected papers will be included in one of international journals after revision and extension. (Please visit Proceedings Page).
The special session proposal should include following information:
1. Title of the special session: Special Session on ...
2. Special Session chair (s): name, affiliation, address, phone and fax numbers and e-mail.
3. Brief description of the Special Session (several hundred words)
4. Expected number of papers to be submitted
5. Call for paper of Special Session (draft version)
6. Tentative list of program committee members (Name, affiliation, country, and email address)
Each Special Session will start to distribute a call for paper after receiving the notification. Papers submitted to each Special Session will be reviewed by the Special Session committee.
Session Session Proposal
Please send your Special Session Proposal to Special Session Management Chair, E-mail: firstname.lastname@example.org.
Each special session chair can decide his/her own paper submission due.
But special session chairs should submit accepted paper list to Session Management Chair before 'Acceptance Notification' date in 'IMPORTANT DATES' part.
All attendees must make the registration. At least one author per paper must be accompanied by one Mandatory Registration. Without a dedicated registration, the paper cannot be included in the Proceedings / Journals.
We recommend credit card registration: Click here to Register
| ORGANIZATION COMMITTEE
Javier Garcia-Villalba, Complutense University of Madrid, Spain
Tae Yong Kim, Dongseo University, Korea
International Editorial Committee
Agusti Solanas, Universitat Rovira i Virgili, Spain
Albert Cheng, University of Houston, United States
Alicia Triviño, University of Málaga, Spain
Aniruddha Bhattacharjya, Amrita Vishwa VidyaPeetham, India
Arnulfo Alanis Garza, Instituto Tecnologico de Tijuana, Mexico
César Benavente-Peces, Universidad Politécnica de Madrid, Spain
Chang Wu Yu, Chung Hua University, Taiwan
Chris Gniady, University of Arizona, USA
Christine Rochange, University of Toulouse, France
Cristina Alcaraz, University of Malaga, Spain
Dae-Ki Kang, Dongseo University, Korea
Enrico Denti, Alma Mater Studiorum - Università di Bologna, Italy
George Perry, University of Texas at San Antonio, United States
Gul Khan, Ryerson University, Canada
Gwanggil Jeon, Incheon National University, Korea
Heikki Kariniemi, Tampere University of Technology, Finland
HoonJae Lee, Dongseo University, Korea
Hoon Ko, J. E. Purkinje University, Czech Republic
Howon Kim , Pusan National University, Korea
Ho-Young Kwak, Jeju National University, Korea
Jaime Lloret Mauri, Universidad Politecnica de Valencia, Spain
Jiann-Liang Chen, National Taiwan University of Science and Technology, Taiwan
João Manuel R. S. Tavares, FEUP - Faculdade de Engenharia da Universidade do Porto, Portugal
Kwang Yeob Lee , Seokyeong University, Korea
Luis Javier Garcia Villalba, Universidad Complutense de Madrid, Spain
Matthieu Martel, LIRMM-Dali Université de Perpignan & CNRS, France
Michele Risi, University of Salerno, Italy
Moustafa Adel, Valeo S.A., Group Electronics Expertise & Development Services, Egypt
Neungsoo Park, Konkuk University, Korea
Niklas Holsti, Tidorum Ltd, Finland
Nizaar Ahmad Mahmoud, Valeo, Egypt
Ramón F. Brena, Tecnológico De Monterrey, Mexico
Sang-uk Shin, Pukyong National University, Korea
Sang-yong LEE, Kongju National University, Korea
Teofilo Gonzalez, University of California at Santa Barbara, USA
Vincenzo Piuri, University of Milano, Italy
Xiaofei Xing, Guangzhou University, China
Yoon Young Park, SunMoon Univeristy , Korea
Young Moon, Syracuse University, United States
Young-guk Ha, Konkuk University, Korea
Yu Gu, Singapore University of Technology and Design, Singapore